TECHNOLOGIES
TECHNOLOGIES FOR LIQUID PROCESS MODULES
For liquid process modules, we have developed similar core technologies for the precision and purity requirements involved in liquid chemical delivery. They include: InFlo™ technology, Spectrym™ technology, and particle characterization technology.
InFlo™ Technology
Delivering a precisely blended stream of chemicals is a critical function in manufacturing, especially when there is a need to dynamically control the flow of individual constituents during changes in the semiconductor manufacturing process. Our flow control technology takes the measure and control of liquid flows to a new level, in which fab owners can tailor the process or delivery method to reduce chemical consumption. The technology is even capable of accommodating dynamic changes in manufacturing recipes. Customers realize significant savings through more efficient use of chemicals - both in bulk delivery and at the tool - which facilitates process optimization previously not possible.
InFlo benefits include:
- Reduces chemical consumption
- Accommodates dynamic recipe changes
- Contributes to significant cost savings
- Optimizes tool performance
Spectrym™ Technology
Chemical processing requires precise, reproducible blends of chemical specific to the wafer substrate. We have expertise in measuring the concentration of constituents in blended chemistries, which ensures the repeatability and precision of the manufacturing process. This results from our pioneering methods that guarantee correct assays, both in batch mode and point-of use. Our ability to supply chemical blend systems provides customers significant return on investments and helps lower cost of ownership. Our concentration management technology delivers a valuable flexibility, as manufacturers adjust to next-generation materials and device sizes.
Spectrym benefits include:
- Measures and validates concentration
- Provides greater flexibility
- Ensures repeatability
- Lowers cost of ownership
Particle Characterization Technology
Because slurry is a two-phased material, manufacturers must concern themselves with its dual nature of having both liquid and solid characteristics. The latest process chemistries, such as those involved in CMP, require that particle sizes and their distribution remain within a uniform range. Large abrasive particles are potentially damaging contaminants, capable of causing scratches to delicate wafer surfaces and leading to poor yield in the final product. Celerity's particle characterization technology incorporates proven methods to ensure process integrity. By tracking particle size and distribution in slurries, the technology can identify any excursion in size or population, and give process operators the opportunity to react to the presence of contaminant particles. Moreover, we can make our particle characterization technology available for both bulk slurries and at the polishing station's point-of-use.
Particle Characterization benefits include:
- Identifies excursions in size or population
- Opportunity to react to the presence of contaminant particles